Turing C256 Uncooled Infrared Core Module adopts an advanced 256×192 wafer-level detector, featuring compact size, lightweight design, and low power consumption to meet SWaP³ (Size, Weight, Power, and Performance) requirements. Its modular assembly offers flexible integration, supported by a comprehensive development toolkit compatible with multiple ARM-based SOC platforms for user-friendly deployment.
Apr, 09, 2025
Mar, 10, 2025